Board shape

Voltage (V)

Power (W)

Width (mm)

Height (mm)

Copper

Copper temp (°C)

Pattern type

Iteration depth: N/A

Used by fractal curves only.

Track pitch: 3.0 mm

Pattern notes

Advantage: Simple, predictable single-layer routing with accessible edge pads, straightforward length control and easy fabrication.

Trade-off: Parallel runs can produce visible hot and cool bands, especially with wide pitch or poor heat spreading.

Input definitions

Power: Target power at the selected copper temperature.
Copper: Finished copper weight after fabrication.
Pitch: Centre-to-centre spacing of adjacent serpentine or spiral tracks.
Iteration: Recursive depth; each pattern receives a safe default when selected.
Radius: Requested trace corner radius, reduced locally where needed.
Drill: Used only for through-hole connection pads.

Pads

Pad shape

Pad W (mm)

Pad H (mm)

Drill (mm)

Radius (mm)

Etch layer

PNG DPI

Mirror image horizontally

Exports black board with white copper, pads and a thin board outline; drill holes remain black. Export front and back separately for two-layer designs.

Hot resistance

-- Ω

Hot / cold current

-- A

Trace length

-- mm

Trace width

-- mm

Min clearance

-- mm

Power density

-- W/cm²

Crossovers

Copper layers used

Electrical assumptions and safety

Power is calculated for constant-voltage DC at the entered copper temperature.
Copper temperature coefficient is 0.00393/°C; cold inrush is therefore higher.
1 oz is modelled as 0.0348 mm finished copper. Etch width and plating tolerances are not included.
Via, pad and connector resistance are omitted from the width calculation.
5 W/cm² is only a conservative warning threshold, not a guaranteed FR-4 thermal limit.
Prototype with current limiting, a fuse and an independent temperature cutoff. Verify resistance before full power.